Mo-Cu Heat Sink Plates

Overview

Mo50-Mo85 heat sink plates for power modules and high-power LED bases.

Specifications

MaterialMolybdenum copper (Mo-Cu)

Grade / TypeMo60Cu40 / Mo70Cu30 / Mo80Cu20 / Mo85Cu15

Density9.9 – 10.3 g/cm³

Size rangethickness 1 – 100 mm · width up to 500 mm

Tolerance±0.02 mm (ground) · ±0.5 mm (as-sintered)

Surfaceas-sintered, ground, turned or polished

MOQ1 pc (stock sizes) · 5 pcs (custom)

Lead time7 – 15 days (stock) · 20 – 30 days (custom)

Hongxin Metal Materials (Dongguan) Co., Ltd.